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Solving SiC MOSFET Packaging Complexities
  • admin
  • 2024-11-18

Solving SiC MOSFET Packaging Complexities

The increasing popularity of wide bandgap devices requires innovative advances in packaging technology to take full advantage of WBG semiconductors.

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Solutions for Integrating GUI, Animation and Graphics into Touch Screen Displays
  • admin
  • 2024-09-27

Solutions for Integrating GUI, Animation and Graphics into Touch Screen Displays

The Microchip Graphics Suite (MGS) is an easy-to-learn, comprehensive solution that simplifies the process of integrating GUIs, animations, and graphics into touchscreen displays.

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ADAS Solutions to Accelerate Smart Driving
  • admin
  • 2024-09-03

ADAS Solutions to Accelerate Smart Driving

ADI's ADAS solutions include precision sensing, intelligent power management, high-speed connectivity and data integrity.

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New Magnetic Packaging Technology for Power Modules: Reducing Power Module Size by 50%
  • admin
  • 2024-08-28

New Magnetic Packaging Technology for Power Modules: Reducing Power Module Size by 50%

These power modules utilize TI's proprietary MagPack integrated magnetic packaging technology, reducing size by up to 23 percent.

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LPDDR5 SDRAM Memory Solutions
  • admin
  • 2024-08-20

LPDDR5 SDRAM Memory Solutions

Micron's PDDR5 DRAM meets the growing demand for higher memory performance and lower power consumption across a wide range of markets, including automotive, client PCs, and networking systems built for 5G and AI applications.

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High Power DC Charging Solutions
  • admin
  • 2024-09-27

High Power DC Charging Solutions

Infineon's CoolSiC MOSFET 2kV 62 mm SiC MOS half-bridge module evaluation board does just that with the EVAL-FFXMR20KM1HDR, a gate driver board for driving a 62 mm module in a half-bridge configuration using Infineon's latest CoolSiC MOSFET technology.

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